Thick film screen printing technology is widely used in semiconductor production, which can be applied to multiple semiconductor production processes such as round crystal coated glass powder, photoresist printing, soldering printing in semiconductor packaging processes
Wafer refers to the silicon wafer used in the production of silicon semiconductor circuits, whose original material is silicon. High purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, then slowly pulled out to form cylindrical monocrystalline silicon. Silicon crystal rods are ground, polished, and sliced to form wafers.
On silicon wafers, various circuit component structures can be processed and made into integrated circuit products with specific electrical functions. In the process of making electronic wafers, it is necessary to apply glass powder on the wafer to ensure that a glass protective layer can be formed on the side of the chip after cutting.
Currently, glass powder coating on wafers is mostly done manually. Mix the glass powder with water, and then apply the mixed glass powder onto the wafer. However, the speed of this method is relatively low, and the quality of glass powder coating depends on the labor ability of the workers. The stability of the coating is poor, which can easily lead to residual glass remaining on the surface of the circular crystal, resulting in a low qualification rate of electronic components and further increasing production costs. Although there are related production processes that use powder wiping or filling equipment to improve coating quality, they still cannot effectively solve various problems such as slow production speed, poor printing accuracy and uniformity.
Thick film screen printing technology is widely used in semiconductor production, which can be applied to multiple semiconductor production processes such as round crystal coated glass powder, photoresist printing, soldering printing in semiconductor packaging processes, and passivation of insulation films.
